carbon NT&F 21..®
MF-WLP-150 Heat Sink Compound
carbon NT&F 21..® Heat Sink Compound is
used especially within the electronics industry for controlling temperature.
The carbon nanofibers, in addition to the silicone-free substrate, facilitate
transfer of heat generated by the CPU or other heat sources (e.g. GPU)
to the cooler, without any great loss. MF-WLP-150 does not contain any
metallic filler, thus it does not react with other media and may be
used in any application. Care should nevertheless be taken to ensure
that the heat sink compound is only applied in areas for which it is
designed.
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With the nano-scale filler, extremely thin layers can be achieved that conduct heat better than conventional compounds.
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Unlike other silicone-free heat sink compounds, MF-WLP-150 works to full capacity as soon as the application begins operation.
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MF-WLP-150 is a medium-viscosity compound and as such may be easily applied by screen printing. Its viscosity may also be varied as desired.
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The compound has been specially designed not to drift, evaporate or give away but yet to be easily removable.
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MF-WLP-150 may be applied by screen printing, by dispenser or hand using a clean, flat object (e.g. plastic spatula).
Properties
| Colour: |
black |
 MF-WLP-150, CPU Cooler |
|
| Specific gravity: | 1.3 g/cc | ||
| Viscosity at 25°C: |
~ 16500 mPa / 60 rpm | ||
| Drift (pump out): |
No drift observed after 90 days at an operating temperature of 90 °C |
||
| Thermal resistivity (rth): |
0.0173 °C/W | ||
| Electrical conductivity: |
< 10-3 Scm-1 | ||
| Processing temperature: | -40°C - +180°C | ||
| Shelf Life: | At least 9 months |